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Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD

Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD

기본 정보
Product Name Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD
Sale Price Call for Price
Product Code EQ-ECO-419-LD
Quantity 수량증가수량감소
상품 옵션
 
  •  Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package
  • High strength film is for bonding wafer ( up to 6" dia ) or thin substrate ( < 2.0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with < 6" diameter vacuum chuck.
  • Width
  • 6.5"
  • Thickness
  • 0.25 mm
  • Length
  • Price sold by 10 feet per quantity
 
  

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법인명(상호) : 엠티아이코리아 코퍼레이션(주) 대표자(성명) : 이청규 사업자 등록번호 안내 : [642-81-02515]통신판매업 신고 기타
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개인정보보호책임자 : 이청규(mti@mtikorea.co.kr) Contact : mti@mtikorea.co.kr 사업자 계좌번호 : 신한은행 140-013-598791 (예금주: 엠티아이코리아코퍼레이션(주))

엠티아이코리아 영남지사 (영남지사) 전화: 053-381-1998       팩스: 053-381-2009
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