SYJ-400 (upgraded EC-400) is a CE certified precise dicing and cutting solution for R&D Lab in Materials and Micro-electronics research field.
It is designed for dicing and cutting almost all kinds of materials up to 4" diameter wafer or 8" L x 4" W x 1" H components.
The EC-400 saw can be computerized with position accuracy of 0.01 mm.
The sample stage with two-angle adjustment allows customers to cut materials at the desired angle with +/- 0.5° tolerance.
Laptop with software and USB cable are installed.
SPECIFICATION
Voltage
•AC 110 V or AC 220 V +/- 10 % •(please select and highlight the working voltage in your requirement.)
Motor
Brush-less magneto DC motor (110V) with variable speed up to 3,000 rpm.
Power consumption : 180 W
Effective Cutting Range
3 dimension : X-axis : 8" Y-axis : 4" Z-axis : 4"
Accuracy
0.0025 mm moving resolution and 0.01 mm position accuracy.
Cutting Blades Kits
•One 4" dia x 0.35 mm thick fully sintered diamond blade •Two pairs of flanges with 62 mm dia. (for dicing) and 42 mm dia.
(for deep cutting)
Control mode
•Manual control / PC control •Brand name laptop with pre-installed software is included
Water Cooling
Assemblies of water jetting, draining, and splashing protection are included.
Net WT & DIMEN
•Net Weight : 28.5 kg •580 L x 560 W x 660 H (mm)
Shipping WT & DIMEN
•Shipping weight : 150 lbs •43" L x 30" W x 34" H (inch)
Warranty & Compliance
One year limited with lifetime support ---but not including damages caused by misuse, such as rusted part from inadequate storage and broken parts by the user.
•Click here to learn how to mount/ align sample •Must use anti-corrosion coolant during cutting to avoid rusting the lead screw.
Please never use water as coolant during cutting. •You may select our LubeCool-150 lubricant as coolant, and build up a small circulation system with 6L circulating coolant tank , which will make the diamond blade cut more efficiently and prevent corrosion. Also, you can use W10-30 motor oil as coolant, which is available at any Auto store. •Always clean machine, especially the lead screw using WD-40 lubricant (1 can included) after each use.
Make sure the X, Y and Z axes can move freely without blocking and rusting. •For dicing Si, Ge, GaAs and quartz, LiNbO3 wafers, you may consider to use 100 microns ultra-thin diamond blade because of less kerfs. •In order to ensure accurate alignment when cutting wafer, you should choose 25x stereo microscope with support frame (P/N ECO 421). •Vacuum chuck and alignment microscope for easy wafer dicing are available as optional parts. •For mounting wafer easily and quickly, you may also choose a vacuum chuck (P/N ECO402) and adhesive film (P/N ECO 419). •Add MT45 microscope set and digital camera head to monitor dicing sample accurately on computer screen (please click picture below to see what looks like)
STANDARD PACKAGE
Part No
Description
Quantity
Picture
EC 401
Cross mount vise
1 pcs
EC 403
Controller with connecting cables
1 set
EC 404
Mechanical chuck
1 pcs
EC 405
Water splash guard for covering 4" blade
1 pcs
EC 406
Aluminum plate
2 pcs
EC 407
Wax for gluing samples
2 pcs
EC 408
Graphite plate for holding samples
2 pcs
EC 409
Fully sintered diamond blade 4"x 0.3 mm x 1/2" arbor
