Thin-Film Battery Preparation

3 Heads Compact 1" RF Plasma Magnetron Sputtering Coater, with DC Magnetron Sputtering Option - VTC-3RF

3 Heads Compact 1" RF Plasma Magnetron Sputtering Coater, with DC Magnetron Sputtering Option - VTC-3RF

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Product Name 3 Heads Compact 1" RF Plasma Magnetron Sputtering Coater, with DC Magnetron Sputtering Option - VTC-3RF
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Product Code VTC-3RF
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Sputtering Source

 

VTC-3RF is a three head 1" RF Plasma magnetron sputtering system designed for non-metallic thin film coating, mainly for multilayer oxide thin films. It is the most cost-effective coater for researching in the new generation of oxide thin films. DC magnetron sputtering option is available upon request for metallic film deposition, enabling three DC, one RF / two DC, and two RF / one DC sputtering head configurations.



SPECIFICATIONS



Input Power




  •      •  Single phase 220 VAC, 50 / 60 Hz
  •      •  1000 W (including vacuum pump and water chiller)
  •      •  If the voltage is 110 V, a 1500 W transformer can be ordered at MTI
            (Click the picture to the left for detail)

Power Source



  

  •      •  13.5 MHz, 100 W RF generator with manual matching is included and connected
             to the sputtering heads

  •      •  Continuous working time:
    •          º  100W: ≤ 1 hour
    •          º  80W: ≤ 1.5 hours
    •          º  70W: ≤ 2 hours
    •          º  60W: ≤ 4 hours
    •          º  50W: ≤ 8 hours

  •      •  Load range: 0 – 80 Ω adjustable. Tuning range: -200j – 200j adjustable

  •      •  The rotatable switch can activate one sputtering head at a time. Sputtering heads
             can be switched “in the plasma” (no breaking of vacuum and plasma during a multilayer
             process)

  •      •  With a DC power supply, the coater can be easily modified into 1” DC sputtering
  •         sources for metallic film deposition, enabling three DC, one RF / two DC, and two
            RF / one DC sputtering head configurations
     (Bottom left picture. Please select from
            the Product Options)

  •      •  Optional 300 W auto-match RF generator is available at extra cost (Click the bottom
             right picture for detail information)

500 W DC Power Supply300 W RF Power Suppl
   


Magnetron Sputtering Head




  •      •  Three 1" magnetron sputtering heads with water cooling jackets (Click Pic #1 for detail
             information) are included and inserted into quartz chamber via quick clamps

  •      •  RF cable replacement can be purchased at MTI (Click Pic #2 for detail information)

  •      •  One manually operated shutter is built on the flange (See Pic #3)   

  •      •  One 10 L/min digitally controlled recirculating water chiller is included for cooling
            sputtering heads (Click
     Pic #4 for detail information)

     
         
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Sputtering Target


  •      •  Target size requirement: 1" diameter x 1/8" thickness max
  •      •  Sputtering distance range: 50 – 80 mm adjustable
  •      •  Sputtering angle range: 0 – 25° adjustable
  •      •  1" diameter Cu target and Al2O3 target are included for demo testing
  •      •  Various oxide 1” sputtering targets are available upon request at extra cost
  •      •  For target bonding, 1 mm and 2 mm copper backing plates are included. Silver epoxy
            (Pic #1) and extra copper backing plates (Pic #2) can be ordered at MTI
         
            
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Vacuum Chamber




  •      •  Vacuum chamber:  256 mm OD x 238 mm ID x  276 mm Height, made of high
             purity quartz
  •      •  Sealing flange: 274 mm Dia. made of Aluminum with high-temperature silicone O-ring
  •      •  Stainless steel shield cage is included for 100% shielding of RF radiation from the
            chamber
  •      •  Max vacuum level: 1.0E-5 Torr with optional turbo pump and chamber baking


Sample Holder


  •      •  Sample holder is a rotatable and heatable stage made of ceramic heater with stainless
           steel cover

  •      •  Sample holder size: 50 mm Dia. for. 2" wafer max (See picture below)

  •      •  Rotation speed: 1 - 10 rpm adjustable for uniform coating

  •      •  The holder temperature is adjustable from RT to 600 °C max (5 min max at 600 °C;
            2 hr max at 500 °C) with accuracy +/- 1.0 °C via a digital temperature controller

                   


Vacuum Pump

 

  •      •  KF40 vacuum port is built in for connecting to a vacuum pump.
  •      •  Vacuum level: 1.0E-2 Torr with included dual stage mechanical pump
            (Click the picture on the left)
  •      •  1.0E-5 Torr with optional turbo pump  (Click the picture below)

       

Optional

  •      •  Precision quartz thickness sensor is optional (Click Pic #1 for detail information).
            It can be built into the chamber to monitor coating thickness with accuracy 0.1 Å
           (water cooling required)
    •          º  Easy USB connection to PC for remote thickness and coating speed monitoring
    •          º  5 pcs quartz sensors (consumable) are included

  •      •  Remote PC control of the temperature controller is optional
            (Click
     Pic #2 for detail information)
    •          º  Easy USB connection to PC for remote temperature control
    •          º  Temperature control software is included. The module is compatible with LabView

  •      •  For DC magnetron sputtering, turbo pump is recommended (Pic #3)

  •      •  Reactive sputtering with N2 or O2 is available with optional gas mixing control station (Click Pic #4 for detail information)

       
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Size

  •      •  540 mm L x 540 mm W x 1000 mm H

Net Weight

  •      •  60 kg


Compliance


  •      •  CE approval
  •      •  MET Certification (UL 1450) is available upon request at extra cost, please contact
            our sales representative for quote.

               


Warranty

  •      •  One years limited warranty with lifetime support


Operation Instruction

   
           
   


Application Notes

  


  •      •  This compact 1" RF magnetron sputtering coater is designed for coating oxide thin
            films on oxide single crystal substrates, which usually does not need high vacuum set-up

  •      •  A two-stage pressure regulator (not included) should be installed on the gas cylinder
            to limit the output pressure of gas to below 0.02 MPa for safe usage. Please use >
            5N purity Ar gas for plasma sputtering

  •      •  For the best film-substrate adhesion strength, please clean the substrate surface
            before coating:

    •          º  Ultrasonic cleaning (Click Pic #1 to order) with the following sequential baths - (1)
                  acetone, (2) isopropyl alcohol - to remove oil and grease. Blow dry the substrate
                  with N2, then hot bake in vacuum to remove absorbed moisture

    •          º  Plasma cleaning (Click Pic #2 to order) may be needed for surface roughening,
                   surface chemical bonds activation, or additional contamination removal

    •          º  A thin buffer layer (~5 nm), such as Cr, Ti, Mo, Ta, could be applied to improve
                  adhesion of metals and alloys

  •      •  For best performance, the non-conductive targets must be installed with a copper
            backing plate. Please refer to the instruction video below (#3) for target bonding

  •      •  MTI supplies single crystal substrate from A to Z (Click Pic #4 to order)

  •      •  MTI RF Plasma Sputtering Coaters have successfully coated ZnO on Al2O3 substrate
             at 500 °C (XRD profile in Pic #5)

  •      •  Test the flexibility of the thin film/coated electrode with EQ-MBT-12-LD mandrel bending
            tester
    . (Click Pic.6 for detail.)

  •      •  HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator
            must shut down the RF generator before sample loading and target changing operations

  •      •  DO NOT use tap water in water chiller. Use coolant, DI water, distilled water,
            or anti-corrosive additives with water

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