Features
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• Diamond Scriber for cutting the thin single crystal substrate such as Silicon, Sapphire, Ge, LiNbO3,
and LiTaO3 Wafer- • The cutting pressure is adjustable by the spring
- • Cutting size:
- º 100 x100 mm ( 4x4")
- º 200 x200 mm ( 8x8'')
- º 300 x300 mm ( 12x12'')
- • Made in Japan
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Cutting Procedure
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• Adjust the height of the diamond scriber- • Tuning the pressure of the spring
- • Placing the substrate
- • Scribing
- • Splitting the substrate
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Replace Diamond Scriber
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• Rotate the diamond scriber height adjustment dial and the spring pressure adjustment dial to the
original point of 0- • Move the slide unit to the diamond scriber replacement position and remove the guide rod
- • Turn the handle over 90 degrees to the left
- • Loosen the screw by using the hex wrench and remove the diamond scriber
- • Install the new diamond scriber and tighten the screw
- • Return the handle to the scribing position and set the guide rod
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Product Dimensions |
•  SYJ-DS100-LD: 210 mm (L) x 210 mm (W) x 140 mm (H) - •
 SYJ-DS200-LD: 310 mm (L) x 310 mm (W) x 140 mm (H) - •
 SYJ-DS300-LD: 410 mm (L) x 410 mm (W) x 140 mm (H)
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| Compliance | - • No UL required because no electric
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| Warranty | - • One year limited warranty with lifetime support
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Operational Manual | |
Application Notes |
• The minimum size of the substrate is at least twice of the thickness. Generally, it is 5 mm x 5 mm.- • Replace the diamond scriber when dull
- • To avoid the spring to be degraded, turn the spring pressure dial to the initial position of 0 after use
- • For the long-term use, wipe the slitting unit guide rod periodically and put grease
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