Cu - Substrates ( single crystal) &polycrystalline

MTI supplys copper single crystal and substrate up to 2" diameter x 3" length in various orientation.   

 

■   General Properties of Cu
Symbol Atomic Number Atomic Weight Crystal structure Density Melting Point
Cu 29 63.546(3 FCC -Face centered cubic 8.96 g/cm3 1357.77 K (1084.62°C, 1984.32°F)
Boiling Point Heat of Fusion Heat of vaporation Thermal expansion Thermal conductivity Electrical Resistivity
2835 K(2562°C,4643°F) 300.4 kJ/mol 16.5 µm/(m·K) (at 25°C) 401 W/(m·K) 16.78 nΩ·m (at 20°C)
 
2" Single crystal boule of Cu
 
Grown by Bridgemen method
 
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