DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-2HD-LD

DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-2HD-LD

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Product Name DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-2HD-LD
Sale Price Call for Price
Product Code VTC600HD2
Quantity 수량증가수량감소
상품 옵션

VTC-600-2HD-LD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and the other RF source for coating non-metallic material. This coating system is designed for coating both single or multiple film layers for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE, etc. (Revised since 9/25/2015.  Film Thickness Monitor is not included.)


Compact Structure

Input Power

  •      •  Single-phase 220 VAC 50 / 60 Hz
  •      •  2000 W (including a vacuum pump and water chiller)

Source Power

  •      •  Two sputtering power sources are integrated into one control box
           (Click picture below to see detailed specs)

    •          º  DC source: 500 W power for coating metallic materials
                (Pic 1)
    •          º  RF source: 300 W power, 13.56 MHz frequency for coating
      -conductive materials (Pic 2)

            -- Pic 1           -- Pic 2    

Magnetron Sputtering Head



Vacuum Chamber

  •      •  Vacuum chamber: 300 mm Dia. x 300 mm Height, made of stainless

  •      •  Viewport: Two pieces of 100 mm Dia. glass. One fixed; one
            detachable for cleaning and replacement

  •      •  Hinged type lid with pneumatic power pole allows easy target


Sample Stage

  •      •  The sample holder is a rotatable and heatable stage made of the
            ceramic heater with copper cover

  •      •  Sample holder size: 140 mm Dia. for. 4" wafer max

  •      •  Rotation speed: 1 - 20 rpm adjustable for uniform coating

  •      •  The holder temperature is adjustable from RT to 500 °C max
            (2 hr max) with accuracy +/- 1.0 °C via a digital temperature


Gas Flow Control

  •      •  Two precision mass flow controllers (MFC) are installed to allow
             inlet of two types of gasses

    •          º  Flow rate: 0 – 200 mL/min adjustable on the touch screen
                  control panel

  •      •  Air inlet valve is installed for vacuum release

Vacuum Pump Station


  •      •  A mobile pump station is included. The sputtering coater can be
            placed on top of the station

  •      •  High-speed turbopump at speed 80L/S is combined with a two-
            stage mechanical pump (220 L/min) for max vacuum level and
            faster pumping speed

  •      •  Standard vacuum level connected with chamber: < 4.0E-5 Torr.

  •      •  Optional at extra cost

  •      •  If choose a 150L/S high-speed turbopump, a vacuum can reach
           10-6 torr  with a chamber  ( 6x10-7 torr with baking)

  •      •  For the ultra-high vacuum up to 10^-7 torr, a getter pump (100L/s
            H2 & O2) is needed in addition to the turbopump. Please consult
            our engineers for detailed customization.

  •         150L/S high-speed turbopump  

      Getter Pump

Water Chiller

  •      •  One digital temperature-controlled recirculating water chiller is
    (Click picture to see details)

    •          º  Refrigeration range: 5~35 °C
    •          º  Flow rate: 16 L/min
    •          º  Pump pressure: 14 psi


    •      •  Precise quartz Film Thickness Monitor is optional, which can be into
              the chamber to monitor coating thickness with an accuracy of 0.10 Å

    •      •  Precision Thin Film & Coating Analysis Systems - EQ-TFMS-LD is
              available at extra cost

    •      •  Various 2” oxide and metallic targets are available upon request at
              extra cost. Silver epoxy and copper backing plates can be ordered
              at MTI


    Overall Dimensions

             Lid closed: 48" × 28" × 32"         Lid open: 48" × 28" × 37"

    Net Weight of Coater

    •      •  160 kg

    Shipping Weight & Dimensions

    •      • 
      Total 2 Pallets
    •      •  #1: 520 lbs, 52" x 40" x 50"
    •      •  #2: 420 lbs, 48" x 40" x 45"


    •      •  CE approval

    •      •  MET Certification (UL 1450) is available upon request at extra cost,
             please contact our sales representative for quote.



    •      •  One year limited warranty with lifetime support

    Operation Instruction



    Application Notes

     Pic 1  

    Pic 2             

    •      •  A two-stage pressure regulator (not included) should be installed on
              the gas cylinder to limit the gas output pressure below 0.02 MPa
              safe usage

    •      •  In order to remove oxygen from the chamber, MTI suggest you to
              use 5% Hydrogen + 95 % Nitrogen to clean the chamber 2-3 times,
              which can reduce the oxygen level to < 10 ppm

    •      •  Please use > 5N purity Argon gas for plasma sputtering. Even
              though 5N purity Ar usually contains 10 - 100 ppm oxygen and H2O
              depending on the supplier. MTI suggest you to use
      gas purification
       to purify gas before filling in. (Click Pic #1 & #2 on the left to

    •      •  For best performance, the non-conductive targets must be installed
              with a copper backing plate. Please refer to the instruction video
              below for target bonding
      (Click Pic #3 below)

    •      •  MTI supplies single crystal substrate from A to Z
             (Click Pic #4 below to order)

    •      •  MTI Sputtering Coaters have successfully coated ZnO on
      2O3 substrate at 500 °C (XRD profile in Pic #5 below)

    •      •  HIGH VOLTAGE! Sputtering heads connect to high voltage. For
              safety, the operator must shut down the RF / DC generator before
              sample loading and target changing operations

    •      •  DO NOT use tap water in water chiller. Use coolant, DI water,
              distilled water, or anti-corrosive additives with water

    Pic 3Pic 4Pic 5