Features
| • 5 magnetron sputtering guns for 5 different target materials- • Depending on the power supplies used (RF or DC), both
metallic and non-metallic materials can be deposited. - • Capable of sputtering 5 target materials to produce various
compositions via different sputtering times / rates - • With optional 5 power supplies, 5 target materials can be
sputtered at the same time for combinatorial sputtering
- • 16 samples can be deposited in one batch with a mask and
a rotating sample holder
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Input Power
| • Single phase 220 VAC, 50 / 60 Hz- • 1000 W (including vacuum pump and water chiller)
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Power Source
| • One 13.5 MHz,300 W auto-match RF generator is included and connected to the sputtering heads
- • The rotatable switch can activate one sputtering head at a
time. Sputtering heads can be switched “in the plasma” without breaking of vacuum during a multilayer process. - • Multiple RF power supplies are optional, which allows user
to sputter multi-target at the same time for combinatorial sputtering - • Laptop with control software is available at extra cost to
control each RF gun's sputtering time and power
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Optional
| • You may choose DC power supply for metallic target sputtering
- • With five DC or RF power supplies, 5 target materials can
be sputtered at the same time for combinatorial sputtering
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Magnetron Sputtering Head
| • Five 1" magnetron sputtering heads with water cooling jackets (Click Pic #1 for detail information) are included and inserted into quartz chamber via quick clamps- • RF cable replacement can be purchased at MTI
(Click Pic #2 for detail information)
- • One manually operated shutter is built on the flange
(See Pic #3)
- • One 10 L/min digitally controlled recirculating water chiller
is included for cooling sputtering heads (Click Pic #4 for detail information)
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Sputtering Target
| • Target size requirement: 1" diameter x 1/8" thickness max- • Sputtering distance range: 50 – 80 mm adjustable
- • Sputtering angle range: 0 – 25° adjustable
- • 1" diameter Cu target and Al2O3 target are included for
demo testing
- • Various oxide 1” sputtering targets are available upon
request at extra cost - • For target-bonding, 1 mm and 2 mm copper backing plates
are included. Silver epoxy (Pic #1) and extra copper backing plates (Pic #2) can be ordered at MTI
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Vacuum Chamber
| • Vacuum chamber is made of 304 stainless steel with reinforcing rib - • Inside vacuum chamber size:
470 mm L × 445 mm D × 522 mm H (~105 Liters, 18.5“x17.5"x 20.5")
- • Round 380 mm Dia. hinged type door with 150 mm Dia
glass window - • Temperature range: -15 to 150 °C
- • Vacuum level: 4.0E-5 torr with turbo pump
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Sample Holder
| • 150 mm diameter rotatable sample holder for coating 16 sample one one batch with different compositions- • Sample holder and mask rotation can be controlled manually
by a button or automatically by a control software (Optional) - • The sample holder temperature is adjustable from RT to
600 °C max |
Vacuum Pump
| • KF40 vacuum port is built in for connecting to a vacuum pump.
- • A compact turbo pump is included (Click the left picture to see
specs) - • 4.0E-5 Torr with optional turbo pump (Click the picture below)
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Optional | • Precision quartz thickness sensor is optional (Click Pic #1 for detail information). It can be built into the chamber to monitor coating thickness with accuracy 0.1 Å (water cooling required) - Easy USB connection to PC for remote thickness and coating speed monitoring
- 5 pcs quartz sensors (consumable) are included
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Net Weight | |
Compliance
| • CE approval- • MET Certification (UL 1450) is available upon request at
extra cost, please contact our sales representative for quote.
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Warranty | - • One years limited warranty with lifetime support
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Application Notes
| • This compact 1" RF magnetron sputtering coater is designed for coating oxide thin films on oxide single crystal substrates, which usually does not need high vacuum set-up • A two-stage pressure regulator (not included) should be installed on the gas cylinder to limit the output pressure of gas to below 0.02 MPa for safe usage. Please use > 5N purity Ar gas for plasma sputtering • For the best film-substrate adhesion strength, please clean the substrate surface before coating:
- Ultrasonic cleaning (Click Pic #1 to order) with the following sequential baths - (1) acetone, (2) isopropyl alcohol - to remove oil and grease. Blow dry the substrate with N2, then hot bake in vacuum to remove absorbed moisture
- Plasma cleaning (Click Pic #2 to order) may be needed for surface roughening, surface chemical bonds activation, or additional contamination removal
- A thin buffer layer (~5 nm), such as Cr, Ti, Mo, Ta, could be applied to improve adhesion of metals and alloys
- • For best performance, the non-conductive targets must be
installed with a copper backing plate. Please refer to the instruction video below (#3) for target- bonding - • MTI supplies single crystal substrate from A to Z
(Click Pic #4 to order) - • MTI RF Plasma Sputtering Coaters have successfully
coated ZnO on Al2O3 substrate at 500 °C (XRD profile in Pic #5)
- • Test the flexibility of the thin film/coated electrode with
EQ-MBT-12-LD mandrel bending tester. (Click Pic.6 for detail.)
- • HIGH VOLTAGE! Sputtering heads connect to high voltage.
For safety, the operator must shut down the RF generator before sample loading and target changing operations - • DO NOT use tap water in water chiller. Use coolant, DI water,
distilled water, or anti-corrosive additives with water
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