MTI KOREA Battery
Battery R & D
- Coin Cell Preparation
- Cylindrical and Prismatic Cell Preparation
- Pouch Cell Preparation
- Battery Test Equipment
- Consumables for Battery R&D Synthesis
- Thermoelectric Materials
- Zinc-Ion Batteries
Crystal & Material
Crystals Substrates : A-Z
Ceramic Substrates : A-Z
Thin Film on Substrates : A-Z
Metallic substrate :A to Z
Nano Powder&Chemical
Target / Evaporation : A-Z
Thermal Processing
Smart Furnaces
- Muffle Furnaces (400-1800°C)
- Tube Furnaces (1- 7 Zones)
- CVD Furnace System
- Hi-Pressure & H2 Gas Furnaces & Hot Pressing
- RTP Furnaces
- Crystal Growth System
- Dry Ovens / Hot Plates
- Melting and Casting
Furnace Accessories
Plasma System
Plasma Sputtering & Cleaning
PECVD
Microspheres-Nanospheres
Inorganic
Organic
Magnetic
Radioactive
Size Standards
Sample Preparation & Analysis
Cutting / Dicing Saws
Polishing Machines
Lab Press & Rollers
Power & Slurry Mill / Mixer
Film Coating
Desktop Machine-shop
Material Analysis
TGA Analysis
Battery / Capacitor Analyzers
Desk-Top X-Ray Instruments
Digital Microscopes
Other Lab Equipment
Glove Box & Fume Hood
Digital Lab Balances
Plasma/UV-Zone Cleaners
Ultrasonics/Water Circulator
UV Equipment & Adhesives
Lab Ware / Accessory
Sample Handling
Gel Sticky Boxes
Membrane Film Boxes
Round Wafer Carriers
IC Tray & Plastic Boxes
Vacuum Pen & Tweezers
Knowledge Center
등록 제품 : 6개
-조건선택- -조건선택-
상품명 : SiC-3C Undoped Epi Film as CMP on both sides of Silicon (100) Wafer after epitaxy growth, 2.2 micron Thick, SiC-3CP-a-4-013, 5x5x0.525mm-1
상품명 : 4"SiC-3C Undoped Epi Film as CMP on both sides of Silicon (100) Wafer after epitaxy growth, 2.3 micron Thick
상품명 : 4"SiC-3C Undoped Epi Film as CMP on both sides of Silicon (100) Wafer after epitaxy growth, 2.2 micron Thick
상품명 : 4" SiC-3C N type Film and CMP on both sides of Silicon (100) N-type Wafer after epitaxy growth, Film:1.3 micron
상품명 : SiC-3C Undoped Epi Film as CMP on both sides of Silicon (100) Wafer after epitaxy growth, 2.2 micron Thick, 10x10x0.525 mm
상품명 : 4" SiC-3C N type Film and CMP on both sides of Silicon (100) N-type Wafer after epitaxy growth, 3.2 micron film Thickness after polishing
