Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspection and assembly. Also it has been applied largely in many fields like optical materials, opto-electonic components, semiconductor, and optical communication. The structure consists of three cushions, the middle cushion called module cushion can be customized to specific shape to hold the devices exactly and safely.
Specifications
TYPE
SP4-12030T/BK
Inside Dimension
4 " diameter
Outside Dimension
120mm x 120mm x 30mm
Color
Cover : Transparent / Body : blac
Module Structure in box
Five 4" diameter foam insert are included, which are anti-static-Electric, and suitable for packing 4" wafer upto 4 pcs in one box
