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Square LaAlO3 Substrates
LaAlO3, (100) orn. 5 x 5 x 0.5 mm substrate , 1 side Epi polished
- Wafer Size
- 5 x 5 x 0.5 mm thickness +/-0.05 mm,
- Wafer Orientation
- (100) +/-0.5 Deg
- Polishing
- One side CMP polished with free sub-surface damaged.
- Surface finish (RMS or Ra)
- < 10A
- Packed
- Under 1000 class clean room. (EPI ready) and in 100 grade plastic bog in a wafer container.
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Working days : Monday to Saturday
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