RSA 6061 ( Al Si0.5 Cu0.3 Mg1.1) Substrate supplied by RSP Technology
Very fine nanostructured alloys (polycrystalline with fine grain) with new functionalities, generated by using Meltspinning process, ultra fast cooling rates with converting more than 1 million degrees per second.
Density
2.7 gram/cm^3
For the detailed physical, mechanical properties and other information please refers to www.rsp-technology.com