The silver epoxy is ideal for bonding the nonmetallic plasma sputtering targets and the copper backing plate.
The silver epoxy is mixed at a non-critical 1 to 1 ratio by weight or volume, and it will provide a quick conductive bond at or above room temperature.
Typical cure times are approximately 4 hours at 75°C.
•Small amounts can take several hours to cure at room temperature. •Cure times can be accelerated by heating. •For the fastest curing times, maximum conductivity and adhesion, heat the bond to between 175° - 250°F (79° - 121°C) for 10 minutes and allow to cool
Operation Instructions
Please click video to learn how to bond a target with backing plate )
Application Notes
•Causes eye and skin burns. Harmful if absorbed through skin. Causes Respiratory tract irritation. May cause allergic skin reaction. •Do not try to cure below 75°F/24°C. •Working temperature range is -131° to 212°F (-55° to 100°C). •Typical working pot life is 10 minutes from mixing. •Please click here to find target from A-Z
