Input Power
| • Single phase 220 VAC, 50 / 60 Hz- • 1000 W (including vacuum pump and water chiller)
- • If the voltage is 110 V, a 1500 W transformer can be ordered at MTI
(Click the picture to the left for detail)
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Power Source
| • 13.5 MHz, 100 W RF generator with manual matching is included and connected to the sputtering heads
- • Continuous working time:
- º 100W: ≤ 1 hour
- º 80W: ≤ 1.5 hours
- º 70W: ≤ 2 hours
- º 60W: ≤ 4 hours
- º 50W: ≤ 8 hours
- • Load range: 0 – 80 Ω adjustable. Tuning range: -200j – 200j adjustable
- • The rotatable switch can activate one sputtering head at a time. Sputtering heads
can be switched “in the plasma” (no breaking of vacuum and plasma during a multilayer process)
- • With a DC power supply, the coater can be easily modified into 1” DC sputtering
- sources for metallic film deposition, enabling three DC, one RF / two DC, and two
RF / one DC sputtering head configurations (Bottom left picture. Please select from the Product Options)
- • Optional 300 W auto-match RF generator is available at extra cost (Click the bottom
right picture for detail information)
| | 500 W DC Power Supply | 300 W RF Power Suppl | |
Magnetron Sputtering Head
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• Three 1" magnetron sputtering heads with water cooling jackets (Click Pic #1 for detail information) are included and inserted into quartz chamber via quick clamps
- • RF cable replacement can be purchased at MTI (Click Pic #2 for detail information)
- • One manually operated shutter is built on the flange (See Pic #3)
- • One 10 L/min digitally controlled recirculating water chiller is included for cooling
sputtering heads (Click Pic #4 for detail information)
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Sputtering Target
| • Target size requirement: 1" diameter x 1/8" thickness max- • Sputtering distance range: 50 – 80 mm adjustable
- • Sputtering angle range: 0 – 25° adjustable
- • 1" diameter Cu target and Al2O3 target are included for demo testing
- • Various oxide 1” sputtering targets are available upon request at extra cost
- • For target bonding, 1 mm and 2 mm copper backing plates are included. Silver epoxy
(Pic #1) and extra copper backing plates (Pic #2) can be ordered at MTI | | 1 | 2 |
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Vacuum Chamber
| • Vacuum chamber: 256 mm OD x 238 mm ID x 276 mm Height, made of high purity quartz- • Sealing flange: 274 mm Dia. made of Aluminum with high-temperature silicone O-ring
- • Stainless steel shield cage is included for 100% shielding of RF radiation from the
chamber - • Max vacuum level: 1.0E-5 Torr with optional turbo pump and chamber baking
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Sample Holder
| • Sample holder is a rotatable and heatable stage made of ceramic heater with stainless steel cover
- • Sample holder size: 50 mm Dia. for. 2" wafer max (See picture below)
- • Rotation speed: 1 - 10 rpm adjustable for uniform coating
- • The holder temperature is adjustable from RT to 600 °C max (5 min max at 600 °C;
2 hr max at 500 °C) with accuracy +/- 1.0 °C via a digital temperature controller
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Vacuum Pump
| • KF40 vacuum port is built in for connecting to a vacuum pump.- • Vacuum level: 1.0E-2 Torr with included dual stage mechanical pump
(Click the picture on the left) - • 1.0E-5 Torr with optional turbo pump (Click the picture below)
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Optional | • Precision quartz thickness sensor is optional (Click Pic #1 for detail information). It can be built into the chamber to monitor coating thickness with accuracy 0.1 Å (water cooling required) - º Easy USB connection to PC for remote thickness and coating speed monitoring
- º 5 pcs quartz sensors (consumable) are included
- • Remote PC control of the temperature controller is optional
(Click Pic #2 for detail information) - º Easy USB connection to PC for remote temperature control
- º Temperature control software is included. The module is compatible with LabView
- • For DC magnetron sputtering, turbo pump is recommended (Pic #3)
- • Reactive sputtering with N2 or O2 is available with optional gas mixing control station (Click Pic #4 for detail information)
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Size | - • 540 mm L x 540 mm W x 1000 mm H
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Net Weight | |
Compliance
| • CE approval- • MET Certification (UL 1450) is available upon request at extra cost, please contact
our sales representative for quote.
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Warranty | - • One years limited warranty with lifetime support
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Operation Instruction
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Application Notes
| • This compact 1" RF magnetron sputtering coater is designed for coating oxide thin films on oxide single crystal substrates, which usually does not need high vacuum set-up
- • A two-stage pressure regulator (not included) should be installed on the gas cylinder
to limit the output pressure of gas to below 0.02 MPa for safe usage. Please use > 5N purity Ar gas for plasma sputtering
- • For the best film-substrate adhesion strength, please clean the substrate surface
before coating:
- º Ultrasonic cleaning (Click Pic #1 to order) with the following sequential baths - (1)
acetone, (2) isopropyl alcohol - to remove oil and grease. Blow dry the substrate with N2, then hot bake in vacuum to remove absorbed moisture
- º Plasma cleaning (Click Pic #2 to order) may be needed for surface roughening,
surface chemical bonds activation, or additional contamination removal
- º A thin buffer layer (~5 nm), such as Cr, Ti, Mo, Ta, could be applied to improve
adhesion of metals and alloys
- • For best performance, the non-conductive targets must be installed with a copper
backing plate. Please refer to the instruction video below (#3) for target bonding
- • MTI supplies single crystal substrate from A to Z (Click Pic #4 to order)
- • MTI RF Plasma Sputtering Coaters have successfully coated ZnO on Al2O3 substrate
at 500 °C (XRD profile in Pic #5)
- • Test the flexibility of the thin film/coated electrode with EQ-MBT-12-LD mandrel bending
tester. (Click Pic.6 for detail.)
- • HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator
must shut down the RF generator before sample loading and target changing operations
- • DO NOT use tap water in water chiller. Use coolant, DI water, distilled water,
or anti-corrosive additives with water
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