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Diamond on Silicon Wafer
Electric Conductive Diamond Film on Insulator(DCI), 5x5 mm , 2 um Thick
Specifications:
- • Film:UNCD (Ultrananocrystalline Diamond)
- • Wafer Size: 5x5x0.5mm
- • Si wafer Orientation: (100) + / - 0.5o
- • Insulating Layer: SiO2
- • Diamond film thickness: 2 micron, Oxide Layer: 1 micron
- • Resistivity: <0.1 ohm-cm
- • Surface Roughness: as grown , RA < 10 nm
- • Package: One 1000 class clean room with 100 class plastic bag
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Working days : Monday to Saturday
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