| |
Diamond on Silicon Wafer
Diamond on Silicon Wafer(DOS), 10X10X0.5 mm, Film:1 um Thick, 1nm Ra
Specifications:
- • Film:UNCD (Ultrananocrystalline Diamond)
- • Wafer Size: 10 x 10 x 0.5mm
- • Silicon wafer Orientation: (100) + / - 0.5o
- • Diamond film thickness: 1 micron, undoped, non-conductive
- • Surface roughness: one sides CMP polished with surface roughness < 10 A
- • Package: One 1000 class clean room with 100 class plastic bag
|
|
|
Working days : Monday to Saturday
|
|
|
