Thermal Oxide Wafer 3" Dia.

Thermal Oxide Wafer:  100 nm SiO2 Layer on the FRONT SIDE (only)  of  Si (111),  3"dia x 0.50 mm t, P-type , 1SP

Thermal Oxide Wafer: 100 nm SiO2 Layer on the FRONT SIDE (only) of Si (111), 3"dia x 0.50 mm t, P-type , 1SP

기본 정보
Product Name Thermal Oxide Wafer: 100 nm SiO2 Layer on the FRONT SIDE (only) of Si (111), 3"dia x 0.50 mm t, P-type , 1SP
Sale Price Call for Price
Product Code SI-SO-Bc76D05C1-100nm
Quantity 수량증가수량감소
상품 옵션
 
  •  Thermal oxide Layer
  • Research Grade , about 80 % useful area
    SiO2 layer on the FRONT SIDE (only) of 3" Silicon wafer
    Oxide layer thickness: 100 nm ( 1000A) +/-10%
    Growth method - Dry oxidizing at 1000oC
    Refractive index - 1.455
    Note: customized oxide layer available upon request from 50 nm - 1000 nm
  •  Silicon Wafer Specifications
  • Conductive type
  • P-ype/ B-dped
  • Resistivity
  • 0.1-1.0 ohm.cm
  • Size
  • 3" +/- 0.5 mm in diameter x 0.5 mm +/- 0.05 mm th
  • Orientation
  • (111) +/- 1o
  • Polish
  • one side polished
  • Surface roughness
  • < 5A
  • Optional
  • you may need tool below to handle the wafer ( click picture to order )