Compact Structure |
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Input Power | • Single-phase 220 VAC 50 / 60 Hz- • 2000 W (including a vacuum pump and water chiller)
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Source Power
| • Two sputtering power sources are integrated into one control box (Click picture below to see detailed specs)
- º DC source: 500 W power for coating metallic materials
(Pic 1) - º RF source: 300 W power, 13.56 MHz frequency for coating
non-conductive materials (Pic 2)
-- Pic 1 -- Pic 2
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Magnetron Sputtering Head
| • Two 2" Magnetron Sputtering Heads with water cooling jackets and shutters are included (Click 1st pic from left.
- • One Sputtering Head Model also available on this product page (in
product options)
- º One is connected to DC source for coating metallic
materials - º The other one is connected to the RF source for non-
conductive materials - º Target size requirement: 2" diameter
- • Customized coater: Two DC heads without RF; two RF heads
without DC; 3 RF heads are available upon request
- • Optional: 148 cm RF cable can be ordered at extra cost for the
replacement (Click the 1st pic from right to order)
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Vacuum Chamber
| • Vacuum chamber: 300 mm Dia. x 300 mm Height, made of stainless steel
- • Viewport: Two pieces of 100 mm Dia. glass. One fixed; one
detachable for cleaning and replacement
- • Hinged type lid with pneumatic power pole allows easy target
change
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Sample Stage
| • The sample holder is a rotatable and heatable stage made of the ceramic heater with copper cover
- • Sample holder size: 140 mm Dia. for. 4" wafer max
- • Rotation speed: 1 - 20 rpm adjustable for uniform coating
- • The holder temperature is adjustable from RT to 500 °C max
(2 hr max) with accuracy +/- 1.0 °C via a digital temperature controller
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Gas Flow Control
| • Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gasses
- º Flow rate: 0 – 200 mL/min adjustable on the touch screen
control panel
- • Air inlet valve is installed for vacuum release
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Vacuum Pump Station
| • A mobile pump station is included. The sputtering coater can be placed on top of the station
- • High-speed turbopump at speed 80L/S is combined with a two-
stage mechanical pump (220 L/min) for max vacuum level and faster pumping speed
- • Standard vacuum level connected with chamber: < 4.0E-5 Torr.
- • Optional at extra cost
- • If choose a 150L/S high-speed turbopump, a vacuum can reach
10-6 torr with a chamber ( 6x10-7 torr with baking)
- • For the ultra-high vacuum up to 10^-7 torr, a getter pump (100L/s
H2 & O2) is needed in addition to the turbopump. Please consult our engineers for detailed customization.
- 150L/S high-speed turbopump
Getter Pump
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Water Chiller
| • One digital temperature-controlled recirculating water chiller is included. (Click picture to see details)
- º Refrigeration range: 5~35 °C
- º Flow rate: 16 L/min
- º Pump pressure: 14 psi
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Optional | • Precise quartz Film Thickness Monitor is optional, which can be into the chamber to monitor coating thickness with an accuracy of 0.10 Å
- • Precision Thin Film & Coating Analysis Systems - EQ-TFMS-LD is
available at extra cost
- • Various 2” oxide and metallic targets are available upon request at
extra cost. Silver epoxy and copper backing plates can be ordered at MTI
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Overall Dimensions
| Lid closed: 48" × 28" × 32" Lid open: 48" × 28" × 37"
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Net Weight of Coater | |
Shipping Weight & Dimensions
| • Total 2 Pallets- • #1: 520 lbs, 52" x 40" x 50"
- • #2: 420 lbs, 48" x 40" x 45"
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Compliance
| • CE approval
- • MET Certification (UL 1450) is available upon request at extra cost,
please contact our sales representative for quote.
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Warranty | - • One year limited warranty with lifetime support
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Operation Instruction
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Application Notes
Pic 1
Pic 2 | • A two-stage pressure regulator (not included) should be installed on the gas cylinder to limit the gas output pressure below 0.02 MPa for safe usage
- • In order to remove oxygen from the chamber, MTI suggest you to
use 5% Hydrogen + 95 % Nitrogen to clean the chamber 2-3 times, which can reduce the oxygen level to < 10 ppm
- • Please use > 5N purity Argon gas for plasma sputtering. Even
though 5N purity Ar usually contains 10 - 100 ppm oxygen and H2O depending on the supplier. MTI suggest you to use gas purification device to purify gas before filling in. (Click Pic #1 & #2 on the left to order)
- • For best performance, the non-conductive targets must be installed
with a copper backing plate. Please refer to the instruction video below for target bonding (Click Pic #3 below)
- • MTI supplies single crystal substrate from A to Z
(Click Pic #4 below to order)
- • MTI Sputtering Coaters have successfully coated ZnO on
Al2O3 substrate at 500 °C (XRD profile in Pic #5 below)
- • HIGH VOLTAGE! Sputtering heads connect to high voltage. For
safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
- • DO NOT use tap water in water chiller. Use coolant, DI water,
distilled water, or anti-corrosive additives with water
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