UNIPOL-1202 machine is equipped with 12" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" in diameter.
It can be used as a standard grinding and polishing machine for preparing metallographic samples as well.
SPECIFICATIONS
Super-Flat 12" (300 mm) Diameter Lapping Plate
Flatness < 0.25 micron / inch2
Precision Rotating Shaft
Running Off < 5 micron
Heavy Duty Cast Aluminum Case with Bright Painting
Color : Black or White
Features
•One cast iron plate for lapping and one cast aluminum plate for polishing. •Two rocking work stations with wafer holders and condition rings, which can be controlled independently for polishing 2 pcs of 4" wafers at the same time.
Two Work Stations with 8° Rocking and adjustable speed
9 rocking / minute
Two Flat Sample Holders for Carrying < 4" Dia. Wafer
105 Dia. x 35 T mm
Two Condition Rings
120 O.D. x 110 I.D. x 32 T mm
Variable Speed of Master Plate with Digital Display
