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Fused Silica Substrates: SiO2
JGS2 fused silica wafers 50.8 mm in dia x 0.1 mm, 2 sides polished(40/20)
- Specification
- • JGS2 fused silica wafer
- • Size: 50.8 (+/- 0.20) mm in dia x 0.1mm (+/- 0.25um)
- • Surface Quality:Ra<1.0nm
- • Non-effective Area: 2.0 mm border
- • TTV: <8um
BOW: <20 um
- • Polishing: Two sides polished (40/20)
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