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Diamond on Silicon wafer
Diamond on Silicon Wafer(DOS), 10X10X0.5 mm, Film:1 um Thick, 1nm Ra
- Film
- UNCD (Ultrananocrystalline Diamond)
- Silicon wafer Orientation
- (100) +/- 0.5o
- Diamond film thickness
- 1 micron, undoped, non-conductive
- Surface Roughness
- one sides CMP polished with surface roughness < 10 nm
- Package
- One 1000 class clean room with 100 class plastic bag
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Working days : Monday to Saturday
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