Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaimination free coolant during crystal cutting. Through several years of effort, finally, MTI provides market a quality diamond wire with reasonable price.
Specifications:
| Part Number | EQ-DW0125x65 |
| Tensile Strength | 30 N |
Features
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• Electroplated diamond wire with 0.125 mm (+/-0.01) diameter based on a high strength steel wire - • 20 microns diamond particle for effectively cutting and slicing of ceramic and crystal.
- • 65 meters (215 feet) per roll as standard package
- • Perfect for cutting Sapphire or SiC single crystal
- • Super quality made in USA
- • Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc
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