Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaimination free coolant during crystal cutting. Through several years of effort, finally, MTI provides market a quality diamond wire with reasonable price.
Specifications:
| Part Number | EQ-DW042x65
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| Tensile Strength | 290 N |
Features
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• Electroplated diamond wire with 0.42 mm (+/-0.03) diameter based on a high strength steel wire- • 40 micron diamond particle (280 grit) for effectively cutting and slicing of ceramic and crystal.
- • 65 meter
- • Perfect for various diamond wire saws in the market
- • Save 50% or more than any competitor.
- • Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc.
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