Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaminant-free coolant during crystal cutting. Through several years of effort, finally, MTI provides market a quality diamond wire with reasonable price.
Specifications:
Part Number
EQ-DW025
Tensile Strength
75 N
Features
• Electroplated diamond wire with 0.25 mm(+/-0.02) diameter based on a high strength steel wire
• 80 microns diamond particle for effectively cutting and slicing of ceramic and crystal.
• 65 mete (215 feet) or 100 meters (333 feet) or 200 meters (656 feet) per roll as standard package,
• Perfect for cutting Sapphire or SiC single crystal
• Super quality Made in USA
• Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc.
Test Result From Multiwire Diamond Saw
• 3" sapphire, 200 / ingot cutting time is about 5 hours
• 3" SiC, single wafer slicing, , cutting time is about 6 hours
