• Precision Polishing Jig for accurate wafer / substrate polishing and back-thinning
• 4" Diameter sample holder vacuum chuck to take wafer or substrate up to 4"
• Vacuum chuck can suck wafer through vacuum pump without wax and make wafer sample mounting clean, faster and flat.
• 2 feet length vacuum tube is included to connect vacuum pump, which keep vacuum pressure during jig rotation
• Thickness control screw fixture with resolution of 0.005 mm to limit stock remove
• One digital micrometer is included with resolution of +/- 1 micron for more accurate control polishing remove
• Two dead weights are included for adjusting polishing gravity
• This Polishing fixture can fit with, Unipol 1202 and Unipol 1502 and any precision 12" or larger polishing machine with York support to achieve automatic polishing or thinning.
• Require a vacuum pump with rate > 70 L/ min.
• Maximum travel distance: 6.7mm
• Net Weight: 18lbs
Product Images
Note: super-hard tungsten alloy is weld on the bottom of jig for polishing responsible
