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SiC-3C Undoped Epi Film as CMP on both sides of Silicon Wafer after epitaxy growth, 1.26 micron Thick, 10x10x0.525mm

SiC-3C Undoped Epi Film as CMP on both sides of Silicon Wafer after epitaxy growth, 1.26 micron Thick, 10x10x0.525mm

기본 정보
Product Name SiC-3C Undoped Epi Film as CMP on both sides of Silicon Wafer after epitaxy growth, 1.26 micron Thick, 10x10x0.525mm
Sale Price Call for Price
Product Code SiC-3CP-10100525-US
Quantity 수량증가수량감소
상품 옵션
 
  •  Specifications
  • Film
  • SiC Epi film with 3C structure grown by PECVD   Thickness: 1.26 micron +/- 10% (can be grown up to 20 micron th;
     the price would be increased with the requested film thickness)
    Orientation: 3C SiC (100)
    Surface: CMP (film chemical mechanical polished) on both sides with
     Ra < 5 Angstrom
    Target doping level: < 1.0E16 /cc
    Type and dopant: N type, Undoped
  • Silicon substrate
  • Size: 10mm x 10mm x 0.525 mm thickness
    Orientation: (100)
    Type: P type / B doped (N type is available as well)
    Resistivity: 1- 5 ohm.cm
    Polish: one side polished
  • Optional
  • We can provide dicing service per customer request
    Optional: you may need tool below to handle the wafer
     (click picture to order)