Features | • Precision Polishing Jig for accurate wafer / substrate polishing and back-thinning- • 4" Diameter sample holder vacuum chuck to take wafer or substrate up to 4"
- • Vacuum chuck can suck wafer through vacuum pump without wax and make wafer sample
mounting clean, faster and flat. - • 2 feet length vacuum tube is included to connect vacuum pump, which keep vacuum pressure
during jig rotation - • Thickness control screw fixture with resolution of 0.005 mm to limit stock remove
- • One digital micrometer is included with resolution of +/- 1 micron for more accurate control
polishing remove - • Two dead weights are included for adjusting polishing gravity
- • This Polishing fixture can fit with, Unipol 1202 and Unipol 1502 and any precision 12" or larger
polishing machine with York support to achieve automatic polishing or thinning. - • Require a vacuum pump with rate > 70 L/ min.
- • Maximum travel distance: 6.7mm
- • Net Weight: 18lbs
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