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Corning Glass
Corning EAGLE XG wafer 100.0 mm dia x 0.7 mm, 2 sp surface quality 60/40
- Corning EAGLE XG Glass Substrates
- Suggested Max. Use
Temperature
- 675 deg C (1,247 deg F)
- Dimension
- 100.0 mm (+/- 0.2 mm) x 0.7 mm (+/- 0.05 mm)
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•High transmission (75 - 80 %)
•Low defect densities
•Low ohmic values
•Surface Quality; 60/40
- Non- effective area
- 2.0 mm Border
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•Highly transparent ,conductive coating
•LCD and OLED applications
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Working days : Monday to Saturday
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