EQ-UNIPOL-1502 machine equips with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" diameter with three workstations. It also can be adopted as a standard grinding and polishing machine for preparing metallographic samples.
SPECIFICATIONS
Voltage
AC 110V and 208-240V (50/60Hz) switchable for worldwide operation.
Power
400W
Two Super Flat Lapping Plate
Flatness< 0.25 micron / Inch²
Precision Rotating Shaft
Running off < 5 micron
Features
• One cast iron plate for lapping and one cast aluminum plate for polishing
• Heavy duty cast aluminum case with bright painting
• Three rocking workstations with wafer holders and condition rings.
• They can be controlled independently for polishing 3 pcs of 4" wafers or 9 pcs of 2" wafers in one running
Adjustable Timer for Auto-stop
0~99 hours
Variable Speed
0 to 125 RPM with digital display
Dimensions
720L *580W *380H mm
Optional Accessories
• Consumables for polishing/lapping/grinding (sand paper, pad, plate, slurry, molding, coolant, etc) Click to enter.