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       •  Real time measurement and analysis: Multi-layer, thin, thick, freestanding and
          nonuniform layers
•      •  Extensive material library: 500+ materials
•      •  Support of parameterized materials: Cauchy, Tauc-Lorentz, Cody-Lorentz, EMA
•      •  Flexible: Desktop or in-situ, R&D or inline.
•      •  Measurement: Thickness, optical constants, surface roughness
•      •  User-friendly and powerful: One-click measurement and analysis
  
  

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       •  Oxides (See Pic 1 for example)
•      •  Nitrides
•      •  Photoresists
•      •  Polymers (See Pic 2 for example)
•      •  Semiconductors: Si, aSi, polySi
•      •  Hard Coating: SiC, DLC
•      •  Polymer Coating: Paralene, PMMA, Polyamides
•      •  Thin Metal Coating  (< 50 nm thickness. See Pic 3 for example)
  
  

  Pic 1 - 3 um LiNbO3	Pic 2 - 45 um PET	Pic 3 - 20 nm Cu

  
  

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       •  15 nm - 50 um  for non-metallic, translucent materials as listed above
  
•      •  Note: metallic films can only be measured up to 50 nm reliably; X-Ray measurements
          are needed for  thicker films
  
  

•      •  400 nm - 1100 nm

•      •  0.01 nm or 0.01%

•      •  0.2% or 1 nm

•      •  0.02 nm or 0.03%

•      •  3 mm minimum

•      •  Minimum 5 mm x 5 mm for reliable measurement  

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       •  3600 pixels Si CCD
•      •  16 bit ADC
•      •  400 - 1100 nm wavelength range
•      •  Spectral resolution: < 1 nm
•      •  Power 100 -240 VAC, 50/60 Hz, 20 W power
  
  
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       •  5 W Tungsten-halogen lamp
•      •  CT 2800 degree
•      •  Lifetime: 10000 hours
  
  

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       •  Fiberoptics, 400 um fiber core
•      •  with spectrometer leg and Illumination leg
  
  

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  The film sample faces up with probe and light source pointing down
  
  
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       •  USB connector to communicate with PC
•      •  One brand new Laptop with software installed is included for immediate use

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       •  Large library of refractive index (n) and extinction coefficient (k) values for the most
          common metallic, dielectric, amorphous and crystalline substrate materials
•      •  Capability for analyzing simple and the most complex film stacks
  
•      •  Error estimation and simulation tools allow for factoring in the effects of changing
          conditions
•      •  Support for parameterized materials with approximations representing optical
          dispersion in a desired  spectral range using few coefficients that can be adjusted
  
  
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•      •  Remote control (TCP) based on Modbus protocol at extra cost

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       •  Bare Si Reference and 200 nm thickness silicon oxide test wafer are included as thin
          film standards for  thickness measurement verification
  
  
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   Dimensions

•      •  205 mm L x 250 mm W x 105 mm H (8" L x10" W x4" H)

   Net Weight

•      •  4.5 kg (10 lbs)

   Shipping Dimensions

•      •  460 mm L x 460 mm W x 460 mm H (18" L x18" W x 18" H)

   Shipping Weight

•      •  9.1 kg (20 lbs)

   Warranty

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•      •  One year limited warranty with lifetime support. (Consumable parts such as thin film
          measurement standard not covered by the warranty)
  
  

   
   Operation Instruction

   Application Note

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  An example of metal thin film thickness measurement using the reflectance spectrometer can be downloaded here (Click Pic below)
  
  
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